[PHOTOS] iPhone 7 Leaked Online? Better Battery & ‘Thinner’ Frame


While Apple did release a new iPhone just recently, it was only done to rekindle the love for 4-inch fans. The whole world is still waiting for the Cupertino firm to release its heavily anticipated iPhone 7, which is the next one in line for the company’s prized flagship handset. Now, it seems that rumours regarding the upcoming handset have already surfaced, and it’s complete with design mock-ups to give excited users a view to what’s coming in the near future.

Marek Weidlich, a design student hailing from the Czech Republic, has designed a rather impressive 3D render of the up and coming iPhone 7. Dubbed as “The Vision Next,” the design mock-ups give the purported handset more of a minimalist design. The bands at the back of the iPhone 6 are gone, and the camera appears to be at the center of the device.

Surprisingly, his designs feature the iPhone 7 as a device that has an edge to edge display. Furthermore, the images also showcase the handset having tactile buttons that pop up on command.


Marek Weidlich


Marek Weidlich


Marek Weidlich

“In last few months I worked on my project about the evolution of iPhone and the future of Apple company in general – how I imagine its future,” Weidlich told Mirror Online.

As far as the rumours go, Apple could launch the iPhone 7 with a much thinner frame, but it’s not going to compromise its battery life. According to Korean new publication ETNews, the company is going to apply a technology called “Fan Out Packaging” for the first time. Furthermore, the report also claims that Apple has already ordered parts from a Japanese Antenna Switching Module (ASM) chip supplier for it.

“Fan Out technology is a technology that increases the number of I/O (Input/Output) terminals within a package by pulling out the wiring of I/O terminals to outside from a semiconductor chip (Die), which is a previous step before packaging,” the report explains. “It is most cost effective from production cost perspective if [the] number of I/O terminals increases within a package while still decreasing the size of a chip.”

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